Olympus - Your Vision Our Future

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Semiconductor Wafer Inspection
By using reflected light microscopy wafers can be inspected for contaminants, roughness or flatness. Brightfield, darfield, and DIC are appropriate methods to detect defects at high resolution. In addition, confocal microscopy can be used to get colour contrast of specimens at various focal layers. Especially for contact hole inspection and inspection of multilayered conductive strips confocal microscopy is the ideal tool.